Semiconductor wafer inspection of precision parts, high-precision spark wire cutting breakthrough
In the field of semiconductor manufacturing, precision is measured in nanometers. As the "eyes" that control chip quality, the processing accuracy of the precision parts inside the wafer inspection equipment directly determines the success or failure of chip inspection. However, traditional processing methods frequently run into obstacles when facing these "nano-level works of art". How can large-scale high-precision spark wire cutting processing become the key to breaking through?
Taking a semiconductor manufacturing project as an example, the precision parts of wafer inspection equipment need to realize complex functions in a very small space. The parts are mostly made of special materials such as tungsten steel and ceramics with high hardness and strong wear resistance. The processing difficulty of these parts can be called a "hell-level" challenge. In terms of dimensional accuracy, the dimensional tolerance of key parts of parts must be controlled within ≤ ±0.00 3 mm, and some micro-apertures even require micron-level accuracy, which is difficult to achieve with traditional processing; in terms of structural complexity, parts often contain tiny deep grooves and ultra-thin wall structures, with the narrowest groove width of only 0.05 mm and the thin wall thickness of less than 0.1 mm, which is very easy to deform or break during processing; in addition, the surface quality requirements of parts are almost harsh, and the surface roughness must reach Ra0. 7-1.4 μm or less, otherwise it will affect the optical performance and operation stability of the inspection equipment.
Large-scale high-precision spark wire cutting provides a perfect solution to these problems with its unique process. This technology uses a continuously moving thin metal wire (electrode wire) as an electrode, and processes through the electro-erosion effect generated by pulse discharge between the electrode wire and the workpiece. When processing precision parts of wafer inspection equipment, its high-precision CNC system and micron-level positioning mechanism can accurately control the movement trajectory of the electrode wire and firmly lock the dimensional error within ≤ ±0.00 3 mm, far exceeding the industry standard. The non-contact processing characteristics allow the 0.05mm narrow groove and 0.1mm thin-walled structure to be fully preserved, avoiding the risk of deformation caused by mechanical stress. At the same time, by optimizing the discharge parameters and processing technology, the surface roughness of the parts can reach Ra0.1μm, ensuring that optical detection is not interfered with.
Zhikai CNC has always been at the forefront of the industry in the research and development and manufacturing of large-scale high-precision spark wire cutting equipment. The company has gathered top R&D talents and invested a lot of resources to overcome core technical problems such as constant tension control of electrode wire and intelligent pulse power supply, and continuously improve the accuracy and stability of the equipment. In order to ensure that customers can produce without worries, Zhikai CNC has built a full range of after-sales service system. The professional technical team responds online 24 hours a day, 7 days a week, and provides one-stop service from equipment installation and commissioning to later maintenance. In addition to the precision parts of wafer inspection equipment, Zhikai CNC's large-scale high-precision spark wire cutting equipment also performs well in the processing of mask frames, etching machine parts and other parts in semiconductor manufacturing, and can tailor high-precision cutting solutions for customers.
Zhikai has always been driven by innovation. As a 20-year-old brand, it has developed its own slow wire function control system and continuously optimized the design and process of medium wire cutting machine tools. With the advantages of efficient cutting, low error and easy maintenance, the equipment performs well in various types of processing, such as musical instrument manufacturing: high-precision parts of guitar tuning devices, printing machinery: fine structure of ink cartridges, leather processing machinery: high-precision edges of leather cutting knives, military equipment: precision parts of armored vehicles, etc. With professional and timely after-sales service, Zhikai provides safe and reliable production guarantees for customers in Ju County, Lanshan District, Wulian County, and Donggang District, helping enterprises to enhance their core competitiveness and achieve leapfrog development. In addition, in order to help everyone better understand the relevant knowledge of medium-speed wire cutting machines, we will soon launch DK7740cad wire cutting equipment, T-type ordinary machine tool wire cutting, 2.5-meter all-in-one wire cutting EDM, C-type fully automatic EDM wire cutting, ZKA400 high-quality wire cutting machine, 2-meter new cnc wire cutting, DK7735 high-end EDM wire cutting machine, C-type cad wire cutting machine equipment, micro fully automatic wire cutting EDM and other related popular science articles. Everyone is welcome to visit and obtain relevant solutions.
If you are troubled by the problem of semiconductor precision parts processing, please contact Zhikai: 18013131588, and work with Zhikai to explore the precise future of semiconductor manufacturing.
